Defect Inspection

Reticle

TeraFab Q-3X

Product Description

The TeraFab Q-3X is a specialized system for multiple-die requalification and incoming quality control applications common to memory fabs, including Flash memory. This system's efficient operation means lower cost of ownership (CoO) than previous systems with increased sensitivity to inspect 45nm generation masks for contamination.

  • Die-to-die detection without STARlight TM single die capability
  • Detects pattern defects and contamination with transmitted or reflected light options
  • Pixel migration benefits with reduction in false defects from sub-resolution assist features (SRAFs) and increased throughput with larger pixel

Application

Incoming Quality Control and Reticle Requalification for memory fabs

Comprehensive Reticle Quality Control Solution
The family of three systems builds on the highly successful STARlight-2TM inspection technology and provides chipmakers with increased flexibility to develop cost-effective reticle quality management strategies.

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