|Teron 600 Series|
Reticle Defect Inspection Platform for Advanced Reticle Development and Manufacturing
The Teron 600 platform for reticle defect inspection at the 2Xnm logic (3Xnm half-pitch memory) node will feature higher resolution and greater defect capture rates versus the current industry-standard platform, TeraScan™XR, and introduce programmable scanner illumination capability. A flexible, low-noise platform, the Teron 600 is designed for reticles created for ILT/SMO, double-patterning lithography (DPL), as well as EUV masks and blanks. The platform is built to be extendible to future optical reticle generations. Moreover, the Teron 600 Series can work with KLA-Tencor’s TeraScan 500 Series reticle defect inspection systems in a mix-and-match strategy to provide a cost-effective solution for manufacturing critical and non-critical layers in a photomask set.
The new Teron 600 Series reticle defect inspection systems will include several features designed to enable production of advanced optical masks and development of EUV masks, including: