Product Description

The TeraScanHR Reticle Defect Inspection System provides powerful technology and productivity features that enable the production of defect free reticles for 45nm. The new defect inspection system includes higher resolution optical imaging for a smaller pixel size, new capabilities for inspecting aggressive Optical Proximity Correction (OPC), and higher speed image processing to improve productivity. This defect inspection system provides three standard defect inspection modes (die-to-die, die-to-database, and contamination) along with both illumination modes (transmitted and reflected light). These new advances in technology enable the TeraScan HR reticle defect inspection system to find all types of reticle defects including random reticle manufacturing defects such as oversize and undersize critical dimensions and Sub-Resolution Assist Feature (SRAF) defects, and extensions. The defect inspection system can also find progressive defects occurring during reticle use in the wafer fab, such as crystals and haze. The TeraScanHR system's high sensitivity, improved productivity, and flexible configurations make it a cost-effective system solution that meets the needs of mask manufacturers and wafer fabs.

• Image acquisition system includes higher numerical aperture optics that supports the new 72 nm pixel and low aberration levels to provide accurate imaging of small features, aggressive OPC, and small defects
• The autofocus subsystem uses a pre-mapping technique to reduce focus error and maintains proper focus for advanced reticles with significant topology
• New modeling algorithms significantly improve the accuracy for small structures such as aggressive OPC which leads to lower false detections and improved sensitivity
• Reflected light inspection combined with transmitted light inspection provides a higher quality defect inspection since reflected light is typically more sensitive to clear defects such as pinholes, extensions, and to defects on clear SRAFs
• Concurrent single scan for transmitted and reflected light modes offers higher productivity which allows reticle manufacturers to provide higher quality reticles at a lower cost per inspection
• New image processing computer which has more than 2x the compute capability of the current generation allowing higher productivity when using compute intensive inspection modes such as transmitted and reflected light together
• Flexible configurations allow reticle manufacturers or wafer fabs to purchase just the capability needed at the time, and then upgrade as more capability is needed in the future

Application

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• Die-to-Database Reticle Inspection Platform
• TeraScanHR Brochure