Spansion Selects KLA-Tencor's E-Beam Inspection Technology
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SAN JOSE, Calif, December 14, 2006 -- KLA-Tencor, Inc. today announced that Spansion, Inc. has selected its eS32 electron beam inspection system for multiple applications in 65nm MirrorBit ® Flash memory production and 45nm development. Spansion's selection of the eS32 was based on the system's proven ability to enhance yield by capturing and identifying critical systematic defects at Spansion's Submicron Development Center (SDC) in Sunnyvale, California.

"Rapid yield ramp on new technologies is critical for competitiveness in the Flash memory market, and KLA-Tencor's eS32 system has combined leading-edge defect sensitivity with high-productivity algorithms to play an important role in our yield-enhancement program," said James Pak, director of engineering at Spansion SDC. "We are integrating this tool into our inspection strategy as we expand its use to our production fabs. With the eS32 system, KLA-Tencor has demonstrated the effectiveness of in-line e-beam inspection technology in Flash memory manufacturing."

KLA-Tencor's e-beam inspection technology is experiencing steady growth as the industry ramps 65nm production and continues with 45nm development. eS32 systems have been shipped to both memory and logic customers in all regions worldwide since its introduction in early 2006, including repeat orders for multiple systems.

"Spansion is one of the industry's most aggressive memory companies, and their selection of the eS32 system for several of their most yield-critical inspection steps demonstrates the real-world production capability of this advanced inspection technology," said Keith Wells, vice president and general manager of KLA-Tencor's e-beam inspection division. "Our e-beam inspection technology offers customers a unique combination of enhanced physical defect capture, as well as superior sensitivity for finding critical voltage-contrast-type defects - electrically active defects that can impact device performance."

The eS32 system enables customers to capture yield-limiting transistor-level defect types, including the growing presence of subtle buried electrical shorts or "open" contacts. The system's e-beam technology features the widest range of operating conditions (beam current, landing energy) and includes pre-charging options optimized for critical memory applications. Leading memory manufacturers are now using the eS32 system in-line to overcome the growing threat of yield loss from buried as well as surface defects.

About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, California, the Company has sales and service offices around the world. An S&P 500 company, KLA-Tencor is traded on the NASDAQ Global Select Market under the symbol KLAC. Additional information is available at http://www.kla-tencor.com.

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