SAN JOSE, Calif., July 10 /PRNewswire/ -- KLA-Tencor Corp. today unveiled its new comprehensive defect inspection solution that delivers high throughput and industry-leading sensitivity for advanced semiconductor processing at the 0.13- and 0.10-micron nodes. In concert, these inspection technologies extend KLA-Tencor's leadership by delivering the performance required to accelerate development, ramp yields and monitor production of these advanced processes. Incorporating the latest breakthroughs in e-beam, ultraviolet (UV) brightfield and darkfield technologies, respectively, KLA-Tencor's eS20XP, 2350 and AIT III inspection tools provide the capability to identify all the critical defects associated with the new processes and materials required to produce today's leading-edge devices. This integrated suite of 300-mm capable inspection tools provides the highest performance with the lowest overall cost of ownership (CoO) currently available on the market.

Shrinking design rules and new processes such as copper interconnect create new inspection challenges. 0.13- and 0.10-micron technology nodes require the shorter wavelengths of illumination provided by e-beam and UV technologies to resolve the smallest pattern geometries and related defects. With the conversion to copper interconnect, the requirement for e-beam technology to inspect high aspect ratio structures and detect electrical defects is more critical to identify yield-limiting problems. Combined with the higher resolution of the industry's fastest darkfield inspection tool, the AIT III, this suite of tools provides the industry's only comprehensive defect inspection solution.

"When integrated with our other inspection tools, as well as our eV300 SEM review system, automatic defect classification (ADC), and PMC-Net(TM) yield information management system, these new industry-leading tools provide the fastest time to corrective action," noted Gary Dickerson, chief operating officer at KLA-Tencor. "From development through production, this solution provides our customers with the capability to improve profitability through accelerated time to market and optimized product performance at the lowest CoO."

eS20XP E-Beam Inspection: Representing the industry's most advanced e-beam inspection tool, the eS20XP has the sensitivity to detect physical defects smaller than 100 nm, and has an industry-leading throughput as much as 100 times faster than competing e-beam tools. With the eS20XP's new advanced charge control technology, customers can now inspect process layers, such as silicon on insulator and low-k dielectrics, which previously could not be inspected due to charging issues. In addition, it can detect defects hidden from traditional inspection techniques such as electrical defects and voids in high aspect ratio dual damascene structures. More than 80 percent of the top foundry, logic and memory fabs use KLA-Tencor's e-beam inspection technology for development and yield ramp of high aspect ratio, back-end etch and chemical mechanical planarization (CMP) processes.

2350 Brightfield Inspection: KLA-Tencor's new 2350 inspection tool is the only UV tool that features ultra-broadband brightfield illumination to enable the resolution of circuit patterns and defects for 0.13-micron production and 0.10-micron development applications. Incorporating an improved image computer and more powerful software, the 2350 delivers a two-fold increase in throughput over KLA-Tencor's previous generation 21xx platform. The 2350 also includes new optical modes that provide superior noise suppression and contrast enhancements on back end of line (BEOL) metal and lithography layers.

AIT III Darkfield Inspection: KLA-Tencor's new AIT III tool delivers high-throughput darkfield inspection with the increased sensitivity needed for 0.13-micron production. The AIT III is based on KLA-Tencor's production-proven AIT platform, which has approximately 400 installations at customer sites worldwide. KLA-Tencor's installed base of AIT IIs can be field upgraded to the AIT III. Ideal for film and CMP production tool monitoring applications, the AIT III provides superior defect capture by suppressing color variation and grain noise. It also provides surface selectivity to minimize detection of previous layer defects.

"Last year, KLA-Tencor introduced a series of inspection tools that enabled the industry to quickly ramp to 0.18-micron production while speeding 0.13-micron development," added Dickerson. "With our latest tools, we are now focusing on 0.13-micron production and 0.10-micron development. This demonstrates our commitment to our customers to be there with industry-leading, innovative solutions ready to meet their development and production needs." Production shipments of the eS20XP began this month. Production shipments of the AIT III and 2350 will begin in Fall 2000. The eS20XP, 2350 and AIT III tools will be showcased at SEMICON West 2000 at the Moscone Center in San Francisco, July 10-12, at booth #426. See accompanying technical fact sheets for more data on the eS20XP, 2350 and AIT III tools.

About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, Calif., the company has sales and service offices around the world. An S&P 500 company, KLA-Tencor is traded on the Nasdaq National Market under the symbol KLAC.

Contact:
Meggan Powers
Director Corporate Communications