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A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z
C
CD SEM
Critical Dimension Scanning Electron Microscope. Provides quantitative metrics on the width of lines and spaces, diameter of contact holes, and other critical shape information pertinent to device performance
characterization
Once a defect or yield excursion has been detected, the process or act of identifying and reviewing the defect in order to determine source
classification
1. The classification of defects by defect type and size for process monitoring, yield learning, and excursion control
2. Benchmarking the performance of a process or equipment tool over a variety of conditions to determine its sensitivity against various input parameters
critical dimension (CD)
Any dimension critical to device performance
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D
defect
Any adversion: particles, contamination, residue, stains, pinholes, pits, etc. that may cause device failure or affect device performance
design rule
Rule established by a chip designer that outlines shape, size, and material required for proper functioning of a device
die
The term for a single semiconductor chip on the wafer
dielectric (low-k)
The nonconducting material used to separate conducting materials. New copper/low-k interconnects have shown to improve circuit density, speed, reliability, and reduce interconnect cross-talk.
dual damascene
New process architecture/structure introduced by the move to copper/low-k interconnects. This process simultaneously creates the trench and the via.
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E
e-beam
electron-beam
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G
geometries
See design rules.
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H
high aspect ratio
Ratio of height to width of a structure
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I
in-line
Measurement or inspection that is taken in the production line of product wafers
in-situ
inspection or measurement sensor inside the process tool
integrated circuit
A complete electronic circuit with transistors and wires connecting these transistors (metal interconnect) on a semiconductor chip.
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L
line monitoring
Monitoring of the health of the production line.
low-k dielectric
A type of insulator which helps isolate metal connections, preventing these from interfering with each other or cross-talk between metal lines.
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M
metrology
The science of measurement, in semiconductor industry typical measurements include: CD, overlay, film thickness
micron
1. One one-thousandth of a millimeter or 10 -6
2. Refers to the width of the smallest patterned feature of a transistor
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O
overlay
Measures alignment error between two layers of a semiconductor device
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P
parametric control
Controlling or measuring those features that have to do with the electrical quality of a device, electrical device performance
process control
The act of controlling a semiconductor manufacturing process within established specifications and/or acceptable deviations
process drift
A semiconductor manufacturing process which over time, begins to drift out of control when should be stable
process optimization
Using an inspection strategy which achieves optimum results for best possible performance and yield
process window
The allowable deviation in stepper focus and exposure to achieve desired device performance
product lifecycle
The progression of a product from concept to development through ramp to production
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R
reticle
Sometimes called a mask or a photomask. Glass plate with chrome on one side in which a pattern is etched. The pattern is transferred to the wafer by shining light through the reticle.
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S
SEM review
To review defects using a Scanning Electron Microscope
shallow trench isolation (STI)
The isolation of one transitor from another
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T
tool monitoring
Monitoring the health of a specific process tool. Inspects wafers from a given process tool in order to monitor the tool's health and to quickly detect tool excursions.
trench
The horizontal metal line patterns through which electrons cross within an integrated circuit
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V
via
A vertical opening that is filled with a conducting material, such as metal to allow for the electrical connection of several layers on the IC, typically either tungston or Cu
void
Key hole openings that are formed when filling in trenches
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W
wafer
The substrate made usually from semiconductor material, such as silicon, that is used as the foundation to build IC's on
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Y
yield
The number of good die as compared to the bad die
yield management
The process by which a semiconductor manufacture maximizes yield
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