EtchTemp, the next-generation in-situ plasma etch wafer temperature measurement tool, captures the effect of the process environment on production wafers and offers unique new temperature measurement capabilities to robustly characterize the high-power, high-frequency etch wafer recipes proliferating at 65nm nodes and below.
The EtchTemp in-situ plasma etch wafer temperature measurement tool enables etch wafer engineers to further visualize, diagnose, and control their processes and process tools, through the significantly increased process temperature measurement capabilities. Enhancements include:
The EtchTemp SensorWafer, supported by the PlasmaSuite Software package, is designed specifically for chamber matching, post-PM qualification, trouble-shooting and process development.
Key features for these applications include: