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Automated macro-defect inspection
Multi-channel, multi-algorithm optical inspection capability enables capture of wafer-level process defects and random macro defects in litho, CMP, etch, passivation and final inspection process modules.
- Automated macro-defect detection allows fast and accurate re-work and scrap decisions
- Inline (run-time) binning capabilities provide faster root-cause analysis, reduced time to correction and more accurate process control
- Individual defect images, wafer maps, wafer images and galleries of maps allow for rapid dispositioning decisions
- Full compliance with I300I standards enables complete integration and rapid deployment in 300mm fabs
The 24xx series combines with other inspection systems to form a PCM (photo cell monitor) strategy that combines backside inspection, photo cell monitoring (PCM), after-develop inspection (ADI) for macro and micro defects, and image qualification for control of reticle defects. This solution delivers significant improvements in defect detection and allows fabs to correct litho process excursions more quickly.
Applications
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Lithography: Detection of macro defects related to stepper, coater, developer, edge-bead removal, handling, and process-recipe (wrong-layer) errors accelerates yield in the litho cell.
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Passivation or Final Inspection: The Viper 2430 captures yield-limiting defects such as pad cracks, residue, and pinholes at high throughput.
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CMP and Etch: Accurate wafer and tool dispositioning in patterning modules relies on the detection of yield-critical CMP defects such as residue and micro-scratches, and the capture of etch-related defects such as corrosion, incomplete etch, over-etch, and no-etch.
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After-Clean Inspection (ACI): Superior inspection and tool monitoring capabilities enable automated After-Clean Inspection for steps such as strip and clean.
Related Information
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