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Automated E-beam inspection
Product Description
- Delivers voltage-contrast detection for inline detection of electrical failures and yield-killing voids.
- Provides optimized sensitivity for capturing physical defects down to 50 nm.
- Enables inspection of high aspect ratio interconnect (HARI) structures and detection of defects even at the bottom of vias, trenches, and interconnects.
- Offers ACC™ (Advanced Charge Control, KLA-Tencor's proprietary technology) for inspection of layers such as dual damascene copper, low-k, resist, and SOI.
- Incorporates KLA-Tencor's IMPACT™ iADC (inline automatic defect classification) for real-time defect classification, trending by defect type, and identification of critical excursions and yield-limiting defects.
- Enables production-line monitoring and engineering analysis.
- Features industry-leading throughput.
The 23xx series, the AITXP series, and the eS25 series form part of a KLA-Tencor strategy that combines inspection technologies that traditionally were isolated, such as brightfield/darkfield and e-beam. This combination offers fabs a new, customized strategy for capturing and controlling defects.
An overall defect-control solution to accelerate yield
Capturing defects is only the first part of defect control. Another critical component is the ability to identify sources of defects quickly so the problem with the process or equipment can be resolved with minimum yield impact. This requires efficient and effective defect review, classification, and analysis. KLA-Tencor delivers an overall solution through the most comprehensive range of defect reduction and control technology available. This includes optical and e-beam inspection systems; a UV reticle inspection system that ensures capture of all defect types; automated defect review and classification systems; and data analysis products that manage, correlate, and integrate the wealth of defect data and images from these and other tools.
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