| AIT |
Inline Defect Inspection System
Product Description The AIT In-line Defect Inspection System offers the exceptional defect sensitivity and high throughput needed for a broad range of advanced in-line excursion monitoring applications, including films, CMP, and non-critical etch and photo modules.Based on proprietary double-darkfield (DDF) laser scanning technology, the AIT is able to detect planar defects, microscratches and particulate contamination at up to 30 wafers per hour at maximum sensitivity, independent of device type. With this capability, fabs can now inspect more lots, more wafers per lot and more die per wafer - providing exceptional sampling statistics so that critical go/no-go decisions can be made with a much higher degree of confidence. Plus, cost-per-inspection is among the lowest in the industry, making it economically feasible to perform in-line process monitoring at more process levels, greatly reducing risk to current yields. The AIT achieves its exceptional defect sensitivity through a number of innovations designed to increase defect capture while decreasing capture of background noise. First, a reduced laser spot size concentrates the laser beam at the site of the defect, causing more light to scatter off the defect and less light to scatter off the pattern and surrounding surface. Second, the AIT employs a unique, double-darkfield laser scattering design, which combines a low angle of illumination with multiple collection optics placed close to the wafer horizon - maximizing the capture of defects while minimizing the capture of surface scatter. For complete information, download the product overview below. Disclaimer: Important information about used products Related Information
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