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Product Description

The 2810 and 2815 are the industry's first memory- and logic-specific full-spectrum DUV/UV/visible brightfield patterned wafer defect inspection tools, detecting a broad range of defect types on all processing layers at high production throughputs. Utilized for systematic yield improvements and baseline defectivity reduction on memory and logic devices at the 55/45nm nodes and beyond, the 281x brightfield defect inspectors serve as a critical component of a fab's yield management strategy.

• Customized optical modes, innovative algorithms and selectable full-spectrum DUV/UV/visible illumination produce high sensitivity to defects of interest on all layers
• An increased data rate over the 2800 brightfield defect inspector results in an improved weighted average throughput in production, enabling higher lot sampling, lower cost of ownership or higher sensitivity inspections
• Commonality and connectivity with other KLA-Tencor inspectors and review tools optimize inspector capacity and reduce production integration time
• Automated recipe optimization tools (such as automatic care area setup), and recipe optimization either off-line or on KLA-Tencor's eDR-5200 review system reduce the time required for recipe creation
• Established, production-proven, highly extendible tool architecture provides reliable line monitoring capability for multiple technology nodes

Applications

CMP: The 281x brightfield defect inspectors detect critical CMP defects such as small voids, helping to reduce yield loss in the CMP process module at all stages of the yield ramp.

Etch: The 281x wafer defect inspectors are used for critical etch line monitoring applications, capturing line thinning, small bridges, protrusions and other yield-limiting etch defect types.  

Photo: The 2810 and 2815 brightfield patterned wafer inspectors help engineers solve the yield issues associated with traditional or immersion lithography by photo-cell monitoring (PCM) or after-develop inspection (ADI).

PWQ: The Process Window Qualification (PWQ) application identifies printed reticle design errors, enabling lithographers to qualify the process window for their sub-45nm designs prior to production.

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• 2810 Product Overview
• 2815 Product Overview

• Back to Basics: After-Develop Inspection (English)
• Comparing Patterned Wafer Inspectors - WATIP
• Immersion Lithography Defect Control

• A New Decision Paradigm for Comparing Patterned Wafer Inspectors
• Defect Monitoring on Memory Devices Using Broadband Brightfield Inspection
• Advantages of Broadband Illumination for Critical Defect Capture at the 65nm Node and Below
• Broadband Brightfield Inspection Enables Advanced Immersion Lithography Defect Detection