| 2138 |
Wafer Inspection System with Ultra-Broadband Technology
Product Description Inline inspection systems must be able to detect all types of yield-limiting defects - whether handling, tooling, or process. Only complete visual access to all defect types ensures comprehensive yield correlation and implementation of effective yield strategies.The KLA-2138 - consistently detects the widest range of yield-relevant defect types on all process layers, at speeds required for high-volume wafer production. Based on KLA-Tencor's proven image processing technology, the 2138 features an ultra-broadband (UBB) illumination source in combination with significantly improved brightfield optics and unique Segmented Auto Threshold (SAT) technology. The result is a dramatic improvement in defect detection sensitivity - especially on wafers with extreme color variation - as well as faster setup times, improved throughput in many applications, and improved wafer alignment reliability. The 2138 is also available with an integrated SMIF minienvironment, reducing overall fab cleanliness requirements while streamlining automation. For complete information, download the product overview below. Disclaimer: Important information about used products Related Information
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