The WaferSight 2's proprietary dual-sided interferometer measures wafer geometry parameters such as thickness, shape and flatness. The wafer geometry data from WaferSight 2, acquired in 3D, is capable of delivering best-of-industry nanotopography and edge of wafer roll-off metrology by utilizing high quality optics in an efficient package, resulting in shorter cycle times, reduced WIP queuing, and more efficient facilities usage.  The WaferSight 2 wafer geometry metrology system helps both IC companies and wafer makers by enabling tighter flatness specifications for bare wafers, helping chipmakers to overcome depth of focus challenges. The WaferSight 2 wafer geometry metrology system's superior optical quality permits excellent tool to tool matching.

Applications

Production Flatness, Thickness and Shape Quality Control

Production wafer shape and geometry metrology provides sub-nm site flatness (SFQR) precision for leading edge design nodes. Industry-leading performance helps wafer manufacturers increase yield, and reduces chipmakers' uncertainty and risk with incoming wafers. Bare wafer flatness is measured after polish in the wafer fab, and IC manufacturers use the WaferSight 2 wafer geometry metrology system for incoming quality control of bare wafers.

Edge Roll-Off Option

Wafer manufacturing issues can affect geometry at the edge of the wafer, causing die defocus and CMP removal non-uniformity. The WaferSight 2 wafer geometry metrology system generates edge roll-off reports to control wafer to wafer as well as angular variations.

Nanotopography Option

Nanotopography can have implications in post CMP film thickness uniformity, as well as CD uniformity.  The WaferSight 2 wafer geometry metrology system is the first metrology system to produce artifact-free chuckless nanotopography plots of frontside and backside wafer surfaces in a single, non-destructive measurement. This parametric qualification data is more cost effective on a single platform.