Optical CD and Shape Metrology Systems
The SpectraShapeTM 9000 dimensional metrology system is used to fully characterize and monitor the critical dimensions (CD) and three dimensional shapes of finFETs, vertically stacked NANDs and other complex features on integrated circuits at the 20nm design node and beyond. Using a diverse array of optical technologies, a new higher intensity light source, and patented algorithms, the SpectraShape optical CD and shape measurement system provides feedback on critical device parameters for a broad range of applications across the IC fab, from the early layers of leading-edge transistors to the last interconnect layers.
AcuShape 2 is the advanced modeling software that interprets the signals from the SpectraShape systems. AcuShape 2 accelerates the process of building robust, usable 3D shape models. It includes a flexible user interface that enables model building by fab engineers with or without assistance from outside experts. Additional AcuShape 2 features, such as Model Optimizer which automates the modeling process, help accelerate time to a reliable solution.
Gate Monitor: Advanced gate processes, such as high k metal gate technologies, finFETs, and high aspect ratios in vertically stacked NANDs and flash devices feature more complex device structures and require control of a greater number of measurement parameters. The SpectraShape optical CD and shape measurement systems produce a detailed description of the shape of gate structures and identify any deviations beyond allowed tolerances. SpectraShape tools measure parameters (e.g. critical dimension, metal gate recess, high k recess, side wall angle, resist height, hard mask height, pitch walking) critical to understanding and controlling the gate process before and after etch.
BEOL Dual Damascene: For back end of line dual damascene processes, small modulations in parameters, such as the bottom diameter of dual-damascene contacts, can seriously impact device yield or reliability. The SpectraShape optical CD and shape measurement systems are used to obtain a comprehensive understanding of trench and contact profiles, providing engineers with a high productivity solution for identifying and monitoring process excursions.