Product Description

The SpectraShape^TM 9000 dimensional metrology system is used to fully characterize and monitor the critical dimensions (CD) and three dimensional shapes of finFETs, vertically stacked NANDs and other complex features on integrated circuits at the 20nm design node and beyond. Using a diverse array of optical technologies, a new higher intensity light source, and patented algorithms, the SpectraShape optical CD and shape measurement system provides feedback on critical device parameters for a broad range of applications across the IC fab, from the early layers of leading-edge transistors to the last interconnect layers.

• Several optical technologies enable measurement of critical parameters for complex device structures, including:
  • Patented spectroscopic ellipsometer (SE) with broadband light
  • Polarized, enhanced ultra-violet reflectometer (eUVR)
  • Multi-azimuth scatterometry
  • Patented multi-channel scatterometry
• New laser driven light source has higher intensity and lower noise, enabling higher sensitivity and improved stability on a broad range of materials and structures
• Superior repeatability, reproducibility, matching and reliability enable characterization of small process variations that affect device performance
• Target-based, non-destructive measurements provide 3D profile information without costly wafer cross-sections
• New, smaller box size supports multi-patterning lithography and smaller scribelanes
• Reduced measurement time compared to previous generation SpectraShape 8xxx tools produces a high-throughput production solution for CD and shape metrology
• AcuShape 2 software package accelerates the process of building robust usable 3D shape models
• Reliable, extendible architecture protects a fab’s capital investment

AcuShape 2 is the advanced modeling software that interprets the signals from the SpectraShape systems. AcuShape 2 accelerates the process of building robust, usable 3D shape models. It includes a flexible user interface that enables model building by fab engineers with or without assistance from outside experts. Additional AcuShape 2 features, such as Model Optimizer which automates the modeling process, help accelerate time to a reliable solution.

Applications

Gate Monitor: Advanced gate processes, such as high k metal gate technologies, finFETs, and high aspect ratios in vertically stacked NANDs and flash devices feature more complex device structures and require control of a greater number of measurement parameters. The SpectraShape optical CD and shape measurement systems produce a detailed description of the shape of gate structures and identify any deviations beyond allowed tolerances. SpectraShape tools measure parameters (e.g. critical dimension, metal gate recess, high k recess, side wall angle, resist height, hard mask height, pitch walking) critical to understanding and controlling the gate process before and after etch.

BEOL Dual Damascene: For back end of line dual damascene processes, small modulations in parameters, such as the bottom diameter of dual-damascene contacts, can seriously impact device yield or reliability. The SpectraShape optical CD and shape measurement systems are used to obtain a comprehensive understanding of trench and contact profiles, providing engineers with a high productivity solution for identifying and monitoring process excursions.

Additional Products

		SpectraShape 8810/8660: Optical CD and shape metrology systems enabling process monitoring of key structural parameters for IC devices at the 32nm and below design node.
		SpectraCD-XTR: Dedicated CD and profile metrology tool providing cost-effective 3D inline profile measurements for a broad range of structures on 90nm, 65nm, and 45nm devices.
		SpectraCD 200: Production-worthy CD metrology system that delivers high-throughput feature profile information for 90nm, 65nm, and 45nm devices with the added flexibility of providing film thickness data.

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• SpectraCD-XTR Product Overview
• SpectraCD 200 Product Overview

• Use of Multiple Azimuthal Angles to Enable Advanced Scatterometry Applications
• Improved Scatterometry Time to Solution for Leading-Edge Logic Applications