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Product Description

The HRP-350 is an automated, advanced surface topography metrology tool, featuring high resolution/high-aspect ratio, stylus-based surface profiling for leading edge 300mm applications. Its ultra-fine 20nm stylus tip option enables down to 45nm-generation profiling at cost-effective throughputs for critical transistor and interconnect applications. Featuring diamond styli down to 20nm radius and a lower-noise platform for enhanced measurement sensitivity, the HRP-350 system offers nanometer-scale stylus technology which matches AFM resolution - without modeling requirements.

Applications

• High-resolution mode enables accurate control of nano-scale features for applications that directly impact device performance, such as Shallow Trench Isolation, CMP in the interconnect, metal film roughness and tungsten plug recess.
• Long-scan mode operates at high throughput to measure Cu CMP dishing and erosion, copper plating, die planarity, and C4 bump height in packaging.

The system's broad portfolio of styli, including the proprietary 20nm UltraSharp™ stylus, are based on diamond materials to offer the longest operating lifetimes, typically up to 100 times longer than AFM tips. New stylus developments further advance the technology not only by shrinking the stylus dimensions, but also enhancing the robustness to enable scanning up to five times faster than the previous HRP-340 system. Other system productivity enhancements contribute up to 40% higher system throughput while profiling critical structures in advanced 65nm and 45nm devices. In addition to the 300mm HRP-350 system, a 200mm or less HRP-250 is also available for IC semiconductor and disk drive manufacturing applications.

Contact our authorized sales representatives in the United States, Asia or Europe and the Middle East, or send an e-mail inquiry to our support team.

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