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Certified Used Equipment

WaferSight 1/2: L1 BOA
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Course Description:

This class provides an introduction to the WaferSight applications. This class is intended to familiarise the student with the basics of using the WaferSight including the WS2 software jobfiles/recipe setup, wafer measurement, and data collection. This class is also intended to introduce the WaferSight measurement technologies and their measurement capabilities.

Length: 5 Days

Course Objectives

Upon completion, student will be able to:
  • Explain the WaferSight operations and WS2 software in setting up recipe.
  • Explain the WaferSight measurement technologies; wafer geometry definitions.
  • Setup recipes to perform measurements on various wafer parameters like: thickness,
  • GBIR, GFLR, Bow, Warp, SFQR, SBIR, SQA, THA, ERO, PBM, ZDD

Current Schedule

Start DateLocation
9th July 2012SingaporeEnroll

 

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