Objectives

Upon completion, student will be able to perform the following:

• Explain the basic principles of system operation
• Identify appropriate system parameters for specific applications, including:
• Validation of recipe settings for min defect, max defect, and expected haze
• List system features and functions of specific components
• Properly start up and shut down the system
• Understand recipe creation & optimization for wafer haze and min defect
• Scan wafers for particle defects and surface features in both darkfield and brightfield channels
• Accurately interpret scan results and display data
• Use a microview to distinguish particle defects from background noise
• Understand import and export
• Set up and manage multiple users
• Use system features to find possible solutions to problems encountered while operating the tool
• Demonstrate competent tool usage and wafer handling techniques
• Explain process of correlating this tool with other KLA-Tencor products
• Describe features of various system improvements and software updates
• Interpret application data from a variety of substrate and film surfaces