2350:L1BOA Basic Operations and Applications
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The 235X Operations and Applications course (23xx Customer L1 BOA) prepares the student to effectively use the 235X Optical Wafer Defect Inspection Tool to provide defect detection data of the high quality needed for Yield Management.This course emphasizes the new technical capabilities of the 235X compared to the preceding (21xx) model line.

The course covers the defect identification theory and operational control of the 235X inspector tools. This course emphasizes the new features of the 235x tools: improved optical resolution using UV illumination, three optical modes (Bright-field, Edge-Contrast and Full-Sky), and In-line Automatic Defect Classification (iADC).

In the first half of the course, students learn fundamental defect identification theory and recipe optimization. In the second half students are introduced to advanced topics, including Segmented Auto Threshold (SAT), In-line Automatic Defect Classification (iADC), and KLARITY.

The goal of this course is to provide the customer the skills and knowledge necessary to operate and optimize recipes on the 23xx product line

  • Audience
    • Process Engineers and Technicians
    • Yield Analysis Personnel
    • Equipment and Maintenance Engineers
  • Prerequisites
    • none
  • Length: 5 days

 

Current Schedule

   There are no classes currently scheduled. Please contact This e-mail address is being protected from spambots. You need JavaScript enabled to view it to request training.


 

Objectives:

Upon completion student will be able to:

  • List and describe the Yield Management Process steps and the role the 2350, 2360, 2365, and 2370 Tools play in this process.
  • State the significance of the effect of defect detection and its economic impact.
  • Describe the theory of defect detection for the Brightfield tools.
  • Identify Recipe parameters for the specified tool.
  • List and describe all features and their options on the task bar of the tool.
  • List and describe the significance of light training and alignment for the Brightfield tools.
  • List all the steps necessary for developing a recipe and optimizing it using a DSW wafer and a product wafer.
  • List and describe the steps necessary for recipe optimization.
  • Describe the general process for classification of defects via automatic classification.
  • Stipulate the interface between the tool and Klarity.

Course Outline:

  • Introduction to Defects and Yield Management
  • 2350 Wafer Inspector: New features and capabilities
  • Key Hardware: Optical, electronic, and digital subsystems
  • Recipe Setup: Alignment, light training, and sensitivity menu parameters
  • Defect Review and Classification: menu parameters
  • Theory: Image processing to detect defects in noisy backgrounds
  • Defect Sizing: Methods implemented in 2350 system software
  • Optimizing Defect Detection: Finding optimal values for model 2350 recipe parameters
  • Derivative Inspections: Setting up an inspection of a new wafer layer
  • Troubleshooting: Recognizing and fixing some common recipe setup problems
  • Segmented Auto Threshold (SAT): Recipes to inspect complex back-end layers
  • Intro to CHESTNUT utility software: Wafer image analysis to optimize SAT recipes
  • Intro to iADC: In-line Automated Defect Classification on the 2350.
  • System Administration: File structure and management of the 2350 system
  • Intro to KLARITY: Automated charts to analyze related data from multiple inspections
 
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