Objectives:

Upon completion student will be able to:

• List and describe the Yield Management Process steps and the role the 2350, 2360, 2365, and 2370 Tools play in this process.
• State the significance of the effect of defect detection and its economic impact.
• Describe the theory of defect detection for the Brightfield tools.
• Identify Recipe parameters for the specified tool.
• List and describe all features and their options on the task bar of the tool.
• List and describe the significance of light training and alignment for the Brightfield tools.
• List all the steps necessary for developing a recipe and optimizing it using a DSW wafer and a product wafer.
• List and describe the steps necessary for recipe optimization.
• Describe the general process for classification of defects via automatic classification.
• Stipulate the interface between the tool and Klarity.

Course Outline:

• Introduction to Defects and Yield Management
• 2350 Wafer Inspector: New features and capabilities
• Key Hardware: Optical, electronic, and digital subsystems
• Recipe Setup: Alignment, light training, and sensitivity menu parameters
• Defect Review and Classification: menu parameters
• Theory: Image processing to detect defects in noisy backgrounds
• Defect Sizing: Methods implemented in 2350 system software
• Optimizing Defect Detection: Finding optimal values for model 2350 recipe parameters
• Derivative Inspections: Setting up an inspection of a new wafer layer
• Troubleshooting: Recognizing and fixing some common recipe setup problems
• Segmented Auto Threshold (SAT): Recipes to inspect complex back-end layers
• Intro to CHESTNUT utility software: Wafer image analysis to optimize SAT recipes
• Intro to iADC: In-line Automated Defect Classification on the 2350.
• System Administration: File structure and management of the 2350 system
• Intro to KLARITY: Automated charts to analyze related data from multiple inspections