The PlasmaVolt™ X2 measures plasma chamber conditions in semiconductor wafer processing systems. With an increased number of embedded sensors and improved spatial resolution, the PlasmaVolt X2 is highly sensitive to changes in various parameters such as radio frequency (RF) power, gas flows, magnetic fields, and chamber design. This plasma behavior measurement and characterization system enables enhanced chamber-to-chamber matching, tool qualification, system troubleshooting, and process development for production environments.

The PlasmaVolt X2 measures “above the wafer” effects in a plasma chamber and provides detailed information about plasma behavior throughout the entire etch process. Results are available immediately after the measurement, reducing time-to-results by hours. With this complete chamber information in hand, etch engineers are now able to compare chambers across the fab and make the necessary process adjustments. Paired with KLA-Tencor’s PlasmaTemp G4, which is designed for temperature measurements, the PlasmaVolt X2 is the best tool to effectively map the complete plasma chamber, for tool monitoring, tool qualification and process development applications.