| eCD-2XP |
Advanced CD SEM Metrology
Delivering the industry’s best productivity, adaptability and stability in a CD SEM platform, the eCD-2XP™ system handles extremely challenging design qualification, process control and technology development requirements for the 45-nm node and below. Advanced algorithms and signal acquisition features provide outstanding performance on argon fluoride (ArF) photoresists. Enhanced imaging modes and beam tilt capabilities are optimized for a wide array of feature aspect ratios and profiles, including VHAR structures. The flexible software and hardware architecture enables waferless recipe setup, “operator-free” automation, and a simple GUI for improved operational efficiency. Innovative features such as image-based (CD2D™) metrology, electrostatic beam steering and offline optimizers accelerate the development of customized scanning methods and new metrology algorithms, allowing faster development cycles and time to market.
CD Control Solution eCD-2XP (advanced CD SEM metrology), 8250/8250-R/8400 Series CD SEMs (reticle and wafer CD SEM metrology), SpectraCD (inline spectroscopic CD metrology), ProDATA (lithography data analysis) and PROLITH (lithography simulation) provide a complete CD solution capable of improving pattern transfer quality, bin yield, and device performance. |
