eCD-2XP
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Advanced CD SEM Metrology
  • Highly stable platform for 45-nm production and 193-nm lithography
  • New electron beam column and high-precision stage for industry-leading angstrom-level precision (3 sigma) and throughput
  • Image Plus™ mode provides control over resolution and depth of focus, enabling very high aspect ratio (VHAR) contact-hole metrology
  • New image-based algorithms enable advanced 2D metrology for line edge roughness and OPC validation
  • Off-axis tilt capability enables fast, reliable and repeatable 3D profile metrology
  • Unparalleled long-term precision and matching
  • Industry-leading automation and simple, user-friendly recipe setup
Delivering the industry’s best productivity, adaptability and stability in a CD SEM platform, the eCD-2XP™ system handles extremely challenging design qualification, process control and technology development requirements for the 45-nm node and below. Advanced algorithms and signal acquisition features provide outstanding performance on argon fluoride (ArF) photoresists. Enhanced imaging modes and beam tilt capabilities are optimized for a wide array of feature aspect ratios and profiles, including VHAR structures. The flexible software and hardware architecture enables waferless recipe setup, “operator-free” automation, and a simple GUI for improved operational efficiency. Innovative features such as image-based (CD2D™) metrology, electrostatic beam steering and offline optimizers accelerate the development of customized scanning methods and new metrology algorithms, allowing faster development cycles and time to market.

CD Control Solution
eCD-2XP (advanced CD SEM metrology), 8250/8250-R/8400 Series CD SEMs (reticle and wafer CD SEM metrology), SpectraCD (inline spectroscopic CD metrology), ProDATA (lithography data analysis) and PROLITH (lithography simulation) provide a complete CD solution capable of improving pattern transfer quality, bin yield, and device performance.