Product Description

At 65 nm and 45 nm, device current density becomes critical in back-end-of-line (BEOL) integration schemes. Controlling electro-migration (EM) and stress migration (SM) is crucial with respect to device reliability. Electroless film deposition enables mitigation of EM and SM at the 65- and 45-nm nodes while maintaining low cost of ownership.

CuSeal from Blue29, a KLA-Tencor and Dainippon Screen company, is an electroless deposition solution that improves device reliability and performance. Its unique sealed single-chamber architecture is ideal for high-quality films and interfaces.

• Removes critical device reliability barriers to copper IC production at the 65- and 45-nm nodes
• Improves device performance by lowering the effective k value around copper lines
• Provides a system qualified for R&D as well as high-volume production
• Provides metrology and inspection solutions for electroless cap layers
• Delivers process chemicals through partnerships with global suppliers
• Features a process development roadmap that addresses new applications at 45 nm and beyond

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