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Product Description

The TeraFab™HT reticle defect inspection system enables fabs to perform "early warning" reticle checks with 28nm logic / 3Xnm hp-node sensitivity, minimizing the risk of printing defective wafers before the excursion is caught. TeraFab reticle defect inspection systems are available as new systems or as field upgrades to existing TeraFab or h Series models.

• Industry-leading sensitivity enables earliest warning of the presence of haze or other progressive or pattern defects
• Unique STARlight™ technology allows TeraFab to inspect all areas of single-die or multi-die reticles in a single pass, including scribe lines, borders and other non-repetitive areas
• Improvements to inspectability through automatic filtering of defects on sub-resolution assist features (SRAFs) or in isolated areas extend inspectable mask types, benefit cycle time and reduce labor costs. Opaque MoSi on Glass (OMOG) masks are supported.
• Up to 2X throughput enhancements through changes to the laser, sensor, data path and compute power, enable higher sampling for earliest warning. Pixel migration for p90 and above can provide additional throughput boost
• Multiple-pixel configuration enables variable sensitivity and throughput for best CoO on critical and non-critical masks
• Factory automation improvements provide remote reticle tracking and “place and walk away” operation
• High resolution provides flexibility for use in incoming quality control (IQC) programs
• Unique data transfer to eDR-5210S e-beam wafer defect review system enhances speed and accuracy of wafer dispositioning after a reticle defect is found
• Optional Klarity Reticle data analysis and management system is designed to help engineers disposition the reticle and optimize its cleaning frequency based on historical trends

Applications

Reticle re-qualification: High sensitivity defect inspections are needed for early detection of haze and other progressive defects that occur unpredictably in the fab. Because these defects threaten the yield of every subsequent wafer printed, capturing the reticle defects before they are printed on the wafer is the best means of protecting yield. Once the reticle is cleaned, it is inspected again to re-qualify it for the production line.

Incoming quality inspection: Many leading fabs use KLA-Tencor reticle inspection systems to verify the specs of reticles delivered to the fab, to check for defects added during shipment, to benchmark vendors, or as part of a routine quality-control program.

Additional Products

TeraFab: Previous-generation reticle inspection system for the fab, with sensitivity and throughput upgrades available.

For more information, click on the Photo Gallery

For other reticle defect inspection tools, please see K-T Certified.

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