Photo GalleryPhoto Gallery

Product Description

The Puma 91xx Series is a family of laser imaging, darkfield patterned wafer inspectors that effectively disposition wafers and improve the predictability of the chipmaking process by capturing critical defects at high production throughputs. Part of a fab's yield management strategy, the Puma 91xx tools provide etch pattern excursion monitoring capability for memory and logic devices at the 55/45nm nodes and beyond.

• Unique optical modes and multiple pixel options provide broad defect type capture at required speed for a range of process layers
• High production throughputs at required sensitivity enable increased lot sampling or lower cost of ownership
• Modular design allows various tool configurations, spanning applications from tool monitoring to advanced etch and photo
• Commonality and connectivity with KLA-Tencor's 23xx/28xx broadband brightfield inspectors and eDR-5200 review system optimize inspector capacity and reduce production integration time
• Brightfield recipe import and recipe optimization on KLA-Tencor's eDR-5200 review system enable operators to produce more accurate Puma inspection recipes in less time
• Established tool architecture and production-proven tool matching result in consistent and reliable excursion monitoring results

Applications

Films: With unique optical features that produce superior nuisance suppression and surface selectivity, the high throughput Puma 91xx defect inspectors provide cost-effective defect detection on all film layers.

CMP: Flexible polarization options and multiple optical modes minimize process variation and enhance critical CMP defect capture, enabling fast and sensitive tool monitoring for CMP interconnect processes.

Etch: Innovative laser imaging technology enables the detection of etch pattern defects (bridging, shorts), making the high throughput Puma 91xx inspectors well-suited for non-critical etch pattern excursion monitoring.

Photo and ADI: The higher throughput Puma 91xx tools complement higher sensitivity broadband brightfield defect inspections by providing an improved sampling option for photo-cell monitoring and after-develop inspection.

Contact Me >

• Puma 9150 Product Overview
• Puma 91xx Product Overview

• Comparing Patterned Wafer Inspectors: WATIP
• Advanced Darkfield Inspection

• Optimizing Feedback Time using High-Throughput Darkfield Imaging (English)
• Optimizing Feedback Time using High-Throughput Darkfield Imaging (Traditional Chinese)
• Metal Line Sidewall Void Monitoring using Darkfield Imaging Inspector (Traditional Chinese)
• A New Decision Paradigm For Comparing Patterned Wafer Inspectors
• The Winning Streak: Advanced Darkfield Inspection for 65nm Design Rules and Below