Narrowband Patterned Wafer Defect Inspectors
The Puma 9650 narrowband optical defect inspection system incorporates technological advances in sensitivity and noise control, providing improved defect capture in yield-critical die areas, such as the edge of SRAM arrays, memory transition regions and page breaks. Upgradeable from the Puma 9550, the Puma 9650 supports high performance excursion monitoring for advanced design nodes by capturing critical defects of interest (DOI) at high production throughputs. Part of a portfolio of advanced wafer defect inspection and review tools that accelerate the development and production ramp of leading-edge devices, the Puma 9650 narrowband inspector provides the sensitivity-at-throughput required to control critical yield excursions for a broad range of applications.
XP Offline is an upgrade option for the Puma 9650 and Puma 9500 Series narrowband wafer defect inspectors. The Offline Setup feature allows engineers to create recipes offline for increased tool productivity. In addition, the Recipe Distribution System and Recipe Comparator features reduce the time required for defect inspection recipe setup and improve recipe quality. XP Offline also allows users to create detailed care areas from standard IC design layout information (GDS format) to improve the capture of yield-relevant defects during inspection and provide more accurate binning of defects based on design region.
SatServer improves tool availability by providing access to inspection setup and review software without using valuable inspector tool time. It provides web based access to the software from any network connected Windows™ PC avoiding the need to install or maintain special software. SatServer’s virtual machine based architecture easily scales to fit a fab’s setup needs. A highly reliable storage array allows users to easily share inspection recipes and inspection result data. Overall, SatServer’s features allow users to more easily collaborate on setup and review tasks, increasing their productivity.
Etch: The Puma 9650’s new signal-to-noise enhancement technologies – pupil engineering, eFence, extended dynamic range and improved Manhattan blocker – enable the capture of yield-limiting etch defects such as bridges, trench residue, extra pattern, footers, and contact defects. The Puma 9650 finds these critical etch defects on both logic and memory devices, with significantly improved detection at array edges, transition regions and page breaks. By capturing yield-relevant etch DOI in all die regions at production throughputs, the Puma 9650 serves as a high productivity solution for identifying and monitoring etch process excursions.
CMP: The Puma 9650’s improvements in Manhattan geometry pattern suppression provide enhanced defect capture on BEOL metal and dielectric CMP layers on logic and memory devices. By capturing micro-scratches, slurry residue, corrosion and other CMP defects at high throughput, the Puma 9650 helps engineers quickly identify process issues in the CMP module.
Lithography: The Puma 9650 narrowband inspector complements higher sensitivity broadband inspections by providing a high productivity option for some photo applications, including after-develop inspection (ADI), photo-cell monitoring (PCM) and process wafer qualification (PWQ). Surface selectivity is achieved with unique optical modes and an innovative product architecture, enabling the Puma 9650 to capture critical photo DOI at high throughput.
Films: The high throughput modes of the Puma 9650 enable its use in films monitoring applications. High-NA collection optics provide the resolution required for detection of very small particles, while flexible polarization options, unique apertures and additional noise suppression technologies produce the surface selectivity required for defect capture on all films layers.