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Darkfield Patterned Wafer Inspection Systems
CMP: The Puma 9500 Series darkfield inspectors capture micro-scratches, slurry residue, corrosion and other CMP defects at high throughput, helping engineers to quickly identify process issues in the CMP process module. Etch: The resolution provided by the Puma 9500 Series’ high-NA collection optics enables the capture of yield-limiting etch defects such as micro-bridges, nano-bridges, protrusions, toppling, and other critical pattern defects. By capturing etch DOI at production throughputs, the Puma 9500 Series serves as a high productivity solution for identifying and monitoring etch process excursions. Lithography: The Puma 9500 Series inspectors complement higher sensitivity broadband brightfield inspections by providing a high productivity option for some photo applications, including after-develop inspection (ADI), photo-cell monitoring (PCM) and process wafer qualification (PWQ). Surface selectivity is achieved with unique optical modes and an innovative product architecture, enabling the Puma 9500 Series to capture critical photo DOI at high throughput. Films: High production throughputs make the Puma 9500 Series a cost-effective solution for films monitoring applications. High-NA collection optics provide the resolution required for detection of very small particles, while flexible polarization options and unique apertures provide the nuisance suppression and surface selectivity required for defect capture on all films layers.
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