The LDS3200 automated macro defect inspection and review system enables capture, review and classification of a broad range of macro defect types at very high throughput. Delivering quick dispositioning decisions (Go, NoGo, Inline Defect Review, Alarm), the system enables fab engineers to take corrective action early, when wafers can be reworked, or process tool problems can be repaired before additional lots are risked. Ideally suited for the lithography module, the LDS3200 systems can be integrated rapidly and seamlessly into a production environment.

• Simultaneous full-color brightfield and multi-angle darkfield optics enable capture of a broad range of macro litho defects
• Up to 130 wph throughput to enable statistically valid lot sampling and quick disposition
• Automated defect inspection of partial die, edge exclusion zone, and scribe areas
• Easy setup including waferless recipe creation to reduce time to production
• Consistent results from tool to tool, day to day, and fab to fab
• Field-proven ROI vs. manual inspection
• The optical review module incorporates UV optics with full autofocus capability for highest resolution (>120nm) review of defects and surrounding structures
• Simultaneous inspection and review of defects using a second wafer stage, for fastest time to results
• User-friendly high performance automatic defect classification (ADC-HP) option, using information from the defect image and stored knowledge to classify defects consistently and accurately
• Specialized automated inspection with SpotCheck

 

Contact Me >

---