Chip Manufacturing

Front-End Defect Inspection

eS35
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Electron Beam Wafer Inspection System

altProduct Description

The eS35 electron beam inspection system enables the identification of yield, reliability and performance issues on 4Xnm and 3Xnm devices by providing the best capture and classification of buried electrical and small physical defects. With significantly improved throughput over its predecessor, the eS35 electron beam inspection system provides higher sensitivity operation or more statistically robust sampling for tighter process control on advanced layers.

 
  • Higher electron beam current density, a smaller pixel and hardware advancements that allow an overall lower noise floor, deliver improved sensitivity to the smallest physical defects and most subtle voltage-contrast issues
  • Increased data rate produces throughputs two to four times higher than the eS32's
  • Widest range of electron beam conditions and most flexible pre-scan conditioning options in the industry enable the capture of defects on the widest range of materials and layers
  • Advanced algorithms, ported from and proven on KLA-Tencor's optical inspectors, reduce the noise floor and maximize sensitivity in each region of the die
  • Enhanced on-board review capability provides high resolution images of defects of interest
  • New defect binning algorithms convert defect data to an actionable Pareto, enabling engineers to resolve defect issues more quickly
  • Innovative µLoop technology provides accelerated detection of systematic defects, with or without a test wafer, for faster root-cause analysis and new process characterization

Applications

DRAM: Critical DRAM defects detected by the eS35 electron beam inspection system include subtle under etch, poly piping, contact under etch, extra poly and capacitor shorts.

Flash: The enhanced resolution of the eS35 electron beam inspection system improves detection of physical defects on the small pitch and high aspect ratio structures of flash devices. Small physical defects captured include poly stringers, electrical shorts, missing salicide and resistive contacts.
Logic: On logic devices, the eS35 electron beam inspection system captures NiSi pipes and other shorts and critical leakage, as well as open vias and resistive contacts.
 
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