High-Sampling Patterned-Wafer Defect Inspection System
Suitable for detecting a wide variety of defects in the sub-micron to five-micron range, the 8900 is the fastest of all KLA-Tencor patterned-wafer defect inspection systems. Based on the production-proven Puma platform, the 8900 enables cost-effective inspection of 200mm or 300mm wafers from initial product development through volume production. The 8900 defect inspection system features several advances designed to enable semiconductor manufacturers to accelerate delivery of their products, reliably and at lower cost:
Image Sensors: The 8900 patterned-wafer defect inspection system represents a single, flexible solution to address the wide range of defect challenges that arise during the manufacturing of CMOS image sensors. The 8900's selectable illumination wavelengths are color-matched to the pixels of the color filter array (CFA), and its inspection pixel size is a good fit to the CMOS image sensor roadmap. As yield-limiting defects can occur at any step in the assembly process, the 8900's ability to inspect any of the CFA or micro-lens layers can help reduce materials waste and cycle time.
CMP: Cost-effective detection and binning of scratches and metal residue are key benefits of the 8900 patterned-wafer defect inspection system's simultaneous brightfield/darkfield architecture and flexible illumination spectrum. The 8900 has at least twice the throughput of alternative inspection systems, enabling higher wafer sampling or even full lot inspection to more quickly capture defect excursions for advanced production nodes.
Outgoing Quality Control (OQC): Providing final material disposition, the 8900 patterned-wafer defect inspection system can identify bad dice and electronically ink-out defects such as pad residues, bubbles, pinholes, striation and defective pixels.