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Product Description

The 2820 and 2825 are high productivity brightfield patterned wafer defect inspection tools, using full-spectrum DUV/UV/visible illumination to capture a broad range of defect types in the lithography cell and other process modules throughput the fab. Utilized for systematic yield improvements and baseline defectivity reduction for memory and logic devices at the 32nm node and beyond, the 282x brightfield defect inspection tools serve as a critical component of a fab’s yield management inspection portfolio.

• Customized optical modes, innovative algorithms and selectable full-spectrum DUV/UV/visible illumination produce high sensitivity to defects of interest on lithography and other process layers
• A 2x data rate over the 281x inspectors ensures high productivity brightfield inspections, enabling higher sensitivity in production, increased lot sampling or lower cost of ownership
• A flexible tool architecture allows upgradeability from the 2800 and 281x tools and extendibility for future technology nodes, providing fabs with the lowest risk path to next-node performance while maximizing the return on their capital investment
• Commonality and connectivity with other KLA-Tencor inspectors and review tools optimize portfolio cost-of-ownership and reduce production integration time
• Online tools such as automatic care area setup work with offline tools such as RICO (found on KLA-Tencor’s eDR-5200 SEM review system) to streamline creation and optimization of inspection recipes

Applications

Lithography: The unique full-spectrum architecture of the 2820 and 2825 provides the flexibility and sensitivity needed for after-develop inspection (ADI), photo-cell monitoring (PCM) and process window qualification (PWQ). Reliable detection of all critical pattern defects and identification of design hot spots help engineers characterize new lithography processes and sources of systematic yield loss throughout the lithography process module.

Etch: The 282x wafer defect inspection tools are used for critical etch line monitoring applications, capturing line thinning, small bridges, protrusions and other yield-limiting etch defect types.

CMP: The 282x inspectors detect key CMP defects such as small voids, helping engineers find and fix yield-loss sources in the process module.

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• Back to Basics: After-Develop Inspection (English)
• Comparing Patterned Wafer Inspectors - WATIP
• Immersion Lithography Defect Control

• A New Decision Paradigm for Comparing Patterned Wafer Inspectors
• Defect Monitoring on Memory Devices Using Broadband Brightfield Inspection
• Advantages of Broadband Illumination for Critical Defect Capture at the 65nm Node and Below
• Broadband Brightfield Inspection Enables Advanced Immersion Lithography Defect Detection