KLA-Tencor’s new optical inspection and e-beam review systems discover, identify and monitor critical defects on 1Xnm IC technologies. By producing comprehensive defect information, this advanced portfolio helps chipmakers rapidly solve yield issues related to innovative device structures, materials and processes. Read more >
Broadband plasma patterned wafer inspectors with ultimate optical sensitivity for discovery of yield-critical defectsLearn more >
Laser scanning patterned wafer inspector with best sensitivity-at-throughput for a wide range of IC applicationsLearn more >
Enhanced DUV unpatterned wafer inspection solution with high productivity for process qualification and monitoringLearn more >
E-beam defect review system with S-ADC for accelerated identification of yield-relevant defectsLearn more >
New advanced defect inspection and review capabilities for the development and production of 16nm and below IC devicesClick on the image to view the video.