Product Description

The eDR^TM-7000 electron-beam (e-Beam) review and defect classification system accurately identifies and sources high resolution images of wafer defects. Utilizing a third-generation e-beam immersion column and an advanced stage, the eDR-7000 defect classification system delivers the performance required to re-locate, image and classify yield-critical defects for the 2Xnm design node and beyond. The eDR-7000 also features industry-leading throughput, enabling increased defect sampling for a more accurate defect Pareto, accelerated defect sourcing, and faster time to resolve yield issues. Defect classification is improved with the addition of offline defect classification capability, automated defect binning with inline Defect Organizer (iDO), and enhanced energy-dispersive x-ray (EDX) composition analysis. In addition to accurately identifying defects detected by the most advanced wafer defect inspection systems, the eDR-7000 defect classification system features several innovative applications that address a broad range of fab use cases, including process window qualification, reticle defect review, and optical patterned wafer inspection recipe optimization.

• Third-generation e-beam immersion column and high resolution stage produce the performance required to support defect imaging and classification of defects at the sub-2Xnm design node
• High precision stage provides a 3x improvement in coordinate accuracy compared to the previous-generation eDR-5210 defect classification system, enabling the use of a 1.0um field-of-view for accurately identifying and imaging of the smallest defects of interest without requiring the time-consuming step of locating the defect at a lower magnification then zooming in for a clear image
• Advanced stage and vibration isolation system enable a four-fold increase in defect review speed compared to the eDR-5210 defect classification system, permitting collection of a larger review sample in the same amount of time for a more accurate representation of the defect population on the wafer
• Automated review flow in production boosts SEM review tool productivity resulting in better cost-of-ownership through the use of two new features:
  • Auto deskew uses reference information from KLA-Tencor’s 282x/283x broadband patterned wafer inspectors to match inspector and review tool coordinate systems and eliminate manual deskew
  • Offline defect classification allows engineers to accurately review and classify defects from any computer in the fab or office
• Automated bare wafer review capability provides effective classification of defects and sourcing of monitor wafer yield issues, using several enhanced or new features compared to the eDR-5210, including:
  • Optimized coordinate exchange with KLA-Tencor’s Surfscan SP3 unpatterned wafer inspector reduces alignment overhead and improves redetection accuracy
  • Improved optical microscope sensitivity provides improved defect re-detection
  • Improved SEM sensitivity enables imaging of ≤20nm bare wafer defects
  • Improved separation of particles from other defect types using the auto-defect classification capabilities of inline Defect Organizer (iDO)
  • Improved defect classification with enhanced energy-dispersive x-ray (EDX) composition analysis
• Unique reticle defect review (RDR) mode enables rapid investigation of sites on the wafer where reticle defects may have printed
• Critical Point Inspection (CPI) allows monitoring of known hot spots – locations where the chip design is less robust to process variation
• Unique connectivity to KLA-Tencor optical patterned wafer inspection systems accelerates inspection recipe optimization and accuracy
• Voltage-contrast imaging mode facilitates review of e-beam wafer inspection data
• High Aspect Ratio (HAR) imaging facilitates review of defects in trenches or holes
• Reliable, extendible architecture protects a fab’s capital investment
• Industry-leading stage speed and unique linkage to KLA-Tencor’s unpatterned wafer inspectors and broadband patterned wafer inspectors enable automated SEM review in production, thereby producing the best SEM review tool cost-of-ownership for IC fabs

Applications

Defect Imaging: The smallest yield-relevant defects are beyond the resolution limits of optical microscopy; therefore electron-beam imaging is essential to capturing an image detailed enough for defect classification. Effective image capture on the e-beam review tool begins with reliable and efficient re-detection of the defect. The eDR-7000 defect classification system features industry-leading stage accuracy that increases the defect re-detection rate. In addition, the eDR-7000 defect classification system’s exceptional image quality is built upon third-generation immersion column design, an innovative collector configuration, and simultaneous top-down and topographic imaging. The eDR-7000 defect classification system is capable of re-locating and imaging the most challenging defects types at advanced design nodes, including defects as small as 10nm or defects located at the bottom of a deep trench or hole. By resolving these challenging defect types, the eDR-7000 defect classification system produces defect Paretos with a much lower percentage of SEM non-visual defects and a higher percentage of defects of interest.

Defect Classification: Accurate defect classification is essential to accurately identifying the source of the defect and addressing the issue in a timely manner. In addition to providing the sensitivity required to resolve yield-critical defects on advanced design node devices, the eDR-7000 defect classification system features industry-leading throughput, enabling increased review sampling for a more accurate representation of the defect population on the wafer. Offline defect classification capability allows engineers to classify defects from any computer in the fab or office while increasing the tool’s availability for imaging work. Enhancements to energy-dispersive x-ray (EDX) composition analysis further aids in defect classification. By providing better quality images and a higher quantity of review data, the eDR-7000 defect classification system delivers a more accurate defect Pareto, accelerating defect sourcing and yield.

Lithography Qualification: The eDR-7000 defect classification system can help map and monitor the process window in the lithography module, through full support of process window qualification (PWQ), focus-exposure matrix (FEM) and other standard techniques. The eDR-7000’s throughput enhancements and support of PWQ 3.0 produce significantly faster process window qualification per layer.

Inspector Recipe Optimization: Design-aware capability and the seamless connectivity between the eDR-7000 defect classification system and KLA-Tencor optical patterned wafer inspectors reduces recipe set up time by ~50%; produces higher quality inspection recipes and results; and enables improved productivity.

Wafer Dispositioning after Reticle Defect Detection: Innovative Reticle Defect Review (RDR) mode allows significantly simplified, accelerated review of potential reticle-induced defect sites. A statistically significant number of die can be visited, which allows more accurate wafer dispositioning.

Incoming Reticle Quality Inspection: The simplicity and speed of RDR mode facilitate the ability to check printability of reticle defects across the process window.

Bare Wafer OQC / IQC: The automated bare wafer review solution provided by the eDR-7000 defect classification system utilizes a high sensitivity optical microscope for re-detection, high resolution SEM imaging, automated defect binning, and reliable energy-dispersive x-ray (EDX) capability. Furthermore, the sensitivity and throughput enhancements of the eDR-7000 defect classification system fully support the review needs of the Surfscan SP3 – providing fast and accurate defect imaging and classification of ≤20nm bare wafer defects. This auto bare wafer review solution is used for effective sourcing of monitor wafer defect issues during development and production for wafer manufacturers – and ensures incoming wafer quality at IC fabs.

 

Contact Me >