Chip Manufacturing

Defect Review

eDR-5210
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Electron-beam Defect Review and Classification System

Product Description

The eDR-5210 electron beam review and classification system features second-generation electromagnetic-field immersion technology to deliver industry-leading image quality for accurate classification of defects. In addition, the eDR-5210 utilizes design-aware technology, automation and connectivity to KLA-Tencor inspection systems to accelerate the identification of defect sources for faster ramp of leading-edge devices.


  • Second-generation electromagnetic-field immersion technology with simultaneous high-resolution top-down imaging and high-resolution topographic imaging enables industry-leading image quality
  • Image quality and stage accuracy improvements increase defect re-detection rate—even of small or low-contrast defects—without the need for a second, time-consuming, high magnification image
  • Proprietary access to optical images from the KLA-Tencor inspection system helps reduce the number of SEM* non-visual (SNV) defects, which are defects detected by the inspection system but missed by the review tool, by identifying previous-layer defects
  • The ability to optimize optical-inspection recipes on the e-beam review tool improves productivity, increases inspector performance, and enables the inspector to provide the review tool with a sample containing more defects of interest
  • When partnered with a KLA-Tencor inspection system equipped with the XP package, the eDR-5210’s RICO® option establishes a design-aware engineering environment that enables the fastest time to process-window characterization by making all critical data available at the same time including a defect-wafer map, die-stack map, design-aware binning, optical patch images, design-clips, live design-file viewing, and live SEM imaging
  • Design-aware technology facilitates process window mapping in the lithography cell through PWQ*, FEM* and other standard methods
  • Design-aware capability supplements the defect data with information from standard IC design layout files to help identify yield-limiting defects and increase their representation in the review sample
  • Automated review solution for bare and blanket-film wafers provides significantly enhanced re-detection and classification of the smallest defects, by leveraging a reliable multi-point wafer alignment technique, spiral search algorithm and automated EDX elemental analysis
Applications

Defect Imaging: The smallest yield-relevant defects are beyond the resolution limits of optical microscopy; therefore electron-beam imaging is essential to capturing an image detailed enough for defect classification. Effective image capture on the e-beam review tool begins with reliable and efficient re-detection of the defect. The eDR-5210 features algorithm and stage-accuracy improvements that increase defect re-detection rate. The tool’s exceptional image quality is built upon second-generation immersion column technology, an innovative collector configuration, and simultaneous top-down and topographic imaging. The eDR-5210 delivers the resolution and flexibility required to image a broad range of defects on a broad range of layers, for all types of advanced devices.

Defect Classification: Accurate defect classification is essential to determining the source of the defect and addressing the issue. Classification algorithms based on the e-beam image benefit from supplemental information about the defect such as elemental analysis, the corresponding optical image from the inspection tool, and the defect’s design context. The eDR-5210 features easy-to-use, production-worthy classification technology designed to result in an actionable defect Pareto.

Lithography Qualification: The eDR-5210 can help map and monitor the process window in the lithography module, through full support of PWQ*, FEM* and other standard techniques.

Inspector Recipe Optimization: Design-aware capability and the seamless connectivity between the eDR-5210 and KLA-Tencor optical inspectors reduces recipe setup time by ~50%; produces higher quality inspection recipes and results; and enables improved productivity.

Acronyms:
SEM: scanning electron microscope
PWQ: process window qualification
FEM: focus-exposure matrix

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