KLA-Tencor’s front-end defect inspection tools cover the full range of yield applications within the IC chip manufacturing process, including incoming wafer qualification, reticle qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection tools find particles, pattern defects and electrical issues on the front surface, back surface and edge of the wafer, allowing engineers to detect and monitor critical yield excursions within the IC chip manufacturing process. Fabs rely on our high sensitivity reticle defect inspection tools to ensure that reticles are defect-free thereby preventing reticle defects from printing on production wafers. The defect data generated by our defect inspection tools is compiled and reduced to relevant root-cause and yield-analysis information with our suite of data management tools. By implementing our front-end defect inspection tools and analysis systems, IC chip manufacturers are able to take quick corrective action, resulting in faster yield improvement and better time to market.
Patterned Wafer Defect Inspection Tools
Macro and Edge Inspection Tools
Unpatterned Wafer Inspection Tools
Reticle Inspection Tools
Data Management Tools