Back-End Defect Inspection
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KLA-Tencor, through its ICOS division, offers a series of standalone defect inspectors for various applications in the semiconductor packaging field. Our Component Inspector (CI) products inspect various semiconductor components that are handled in a tray, such as microprocessors or memory chips. Component defect inspector capability includes: 3D coplanarity inspection; measurement of the evenness of the contacts; and, 2D surface inspection to check the package’s surface aspects, the identification mark and the orientation. Our Wafer Inspector (WI) products inspect either undiced wafers, or diced wafers mounted on film frame carriers. This wafer defect inspector inspects surface quality of the wafers, the quality of the wafer cutting, or wafer bumps

Component Defect Inspector

Wafer Defect Inspector

  • ICOS WI-2xx0: Optical defect inspector and metrology of microelectronic devices on a variety of wafer substrates
  • ICOS WI-22xx Series: Automated optical defect inspector and metrology of microelectronic devices on a variety of wafer substrates, surface inspection, and 2D bump inspection
  • ICOS WI-2280: Next-generation wafer defect inspector capabilities and flexibility for LED applications.




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