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AIT II
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Patterned Wafer Inspection System

Product Description

The AIT II is the industry's first 150 to 300 mm-capable patterned wafer inspection system to provide the throughput, sensitivity and low cost-of-ownership required for fast, accurate feedback on process tool performance. The AIT II also offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information.

High-speed, high-sensitivity patterned process tool monitor for wafers up to 300 mm
In contrast to line monitoring - which typically consists of inspecting a certain number of randomly chosen wafers per lot at each point in the manufacturing line and correlating the defect data to yield - process tool monitoring consists of inspecting wafers from a given process tool and immediately feeding back information to the process engineer. By monitoring a process tool's total defect count - or defect count by type - tool monitors are able to immediately detect defect excursions so that critical go/no-go decisions can be made quickly and with a high degree of confidence. Monitoring the performance of process tools using product wafers is a growing trend as it offers key advantages: it maximizes the percentage of product wafers inspected in-line, reducing process excursions and the number of wafers at risk; increases overall equipment effectiveness (OEE); improves yield stability/predictability; and augments line monitoring.

The AIT II is designed to meet the demands of patterned process tool monitoring with flexibility for films, etch, photo, and CMP applications.

For complete information, download the product overview below.


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AIT II Product Overview