Product Description

Macro after-develop inspection, or macro ADI, has traditionally been a manual, operator-intensive process since more than three-quarters of yield-relevant defect types are fairly large and can be seen by the human eye. Unfortunately, manual macro ADI has a number of severe limitations: Defect detection and classification is inconsistent and unreliable, with results varying significantly between operators due to wafer complexity, inappropriate sampling, noise from background patterning, and operator boredom and fatigue.

As a result, up to 80 percent of all macro ADI defects typically go undetected until after etch or final test - when it is too late to take corrective action - resulting in higher scrap rates and lower sort yields. And, because macro defect inspection is performed manually, very little data are collected, making it difficult to drive process improvement cycles.

Automated macro ADI captures all critical defect types
KLA-Tencor's 2401 Automated Macro Defect Inspection System overcomes these limitations, replacing the manual bright light macro defect inspection performed by operators. 2401 Automated Macro Defect Inspection System provides automated detection, classification and reporting of all yield- critical macro ADI defect types, including hotspots, scratches, large particles, extra and missing resist, unexposed fields, striations, developer spots and splashback. With sensitivity superior to that of operators, the 2401 Automated Macro Defect Inspection System detects defects reliably and repeatably, allowing disposition decisions to be made quickly and accurately, dramatically reducing scrap and preventing further investment in low-yielding wafers.

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• 2401 Product Overview