Product Description

The 235x utilizes broadband ultraviolet (UV)/visible illumination and advanced noise suppression technology to provide the resolution and sensitivity required to detect critical defects at 0.13 µm and 0.10 µm design rules. This system features new Full SkyTM and Edge ContrastTM modes. These modes deliver increased defect sensitivity on front end of line (FEOL) layers and better noise suppression on back end of line (BEOL) layers. The 235x is capable of inspecting 200mm or 300mm patterned wafers, and provides higher throughput than its predecessors. With the addition of in-line automatic defect classification (iADC) and PMC-Net TM integrated data analysis capabilities, the 235x provides fast and consistent classification and identification of yield-limiting defects.

• Utilizes broadband UV / visible light and high numerical aperture optics to provide increased resolution over previous visible-light brightfield inspection tools, enabling higher signal-to-noise ratios for smaller critical defects that impact 0.13 µm and 0.10 µm design rules
• Increases sensitivity on FEOL and BEOL layers with Edge Contrast and Full Sky noise suppression technology modes
• The automatic defect classification feature classifies defects in real time during inspection and provides immediate feedback on defect types using in-line automatic defect classification (iADC)
• Uses UV-sensitive high-resolution optics to increase review resolution so recipe setup and SEM review times are minimized for higher resolution recipes
• Reduces recipe setup time and improves recipe robustness with new algorithms, noise suppression optics, and a recipe setup wizard
• Allows users to set a separate threshold for edge die with the Mass Memory Edge Die (MMED) feature so high sensitivity inspections are maintained throughout the wafer

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