The WI-3x00 Wafer Inspector is the first bump inspection system available on the market that is both extremely accurate and fast, making 100% inspection of bumped wafers possible. This bump inspection system combines surface inspection and 2D/3D bump inspection in one high speed pass. Bump inspection covers for example solder and gold bumps and UBM.
The WI-3200 bump inspection system is a manual loading system, and inspects for bumps on any wafer type without hardware changeover, including whole wafers from 2 to 8 inches. The WI-3300 bump inspection system is fully automated, and measures whole wafers from 8 to 12 inches.