Chip Manufacturing

Back-End Defect Inspection

ICOS CI-T620 Component Inspector
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Product Description

Building on the industry-leading ICOS Component Inspector Series, the ICOS CI-T620 is a fully automated optical inspector of integrated circuit (IC) packages for 3D measurements and package quality. The CI-T620 has the added enhancement of two tapers for increased output — significantly reducing cost of ownership. The system offers superior inspection through 3D metrology, as well as scalability to a wide range of packages and sizes.

New Features

  • Dual Tape
    Dual tapers for fast output to accommodate package changeover faster than prevailing industry methods, which increases units per hour (UPH) and therefore, reduces the total cost of ownership
  • 14 Nozzle Inspection Handling
    The devices are brought to the inspection module with 14 nozzles.
  • Dynamic Tray Compensation (DTC)
    Camera measures the tray dimensions/tolerances and compensates for flex in the tray
  • 6 Nozzle Taping With automatic pitch changeover
  • Top inspection in parallel with taping process
    Minimizes impact of yield on throughput

Low Cost of Ownership

The CI-T620 offers higher productivity per machine with its proprietary dual-taper design which allows it to run longer at high speeds without system interrupts, enabling limited operator setup and tool management to maximize manufacturing efficiency. The system’s vastly decreased package changeover time with ease of use helps increase system throughput, or units per hour (UPH), and reduces the total cost of ownership.

System Accuracy

The CI-T620 is well-equipped to handle tighter tolerances required by today’s market requirements. Advanced inspection is realized through the CI-T620’s proprietary 3D metrology technology down to 5 micrometers (µm). The system also offers high-resolution imaging, with improved inspectability of surface defects and micro-cracks down to 40µm.

Inspection Flexibility

The CI-T620 offers scalability to a wide range of packages and sizes, offering the largest package inspection range and suite of options available today. The system is uniquely able to handle irregularly shaped and patterned interconnects. A complete portfolio of 2D and 3D inspection capabilities is supported by proprietary technology.

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