The CI-T120S and -T130S Component Inspectors are configured for highly accurate metrology, and high-volume 2D and 3D bump inspection, of flip-chip substrates. These component inspection systems combine bump inspection, substrate top and bottom surface inspection, and substrate warpage inspection — all in one system. These component inspection systems can measure a wide range of package sizes and features with rapid changeover, making them ideal for quality control on flip-chip substrates. The CI-T130S version offers extended functionality, with inspection a larger range of substrate sizes
and allows more advanced illumination of the
bottom surface of the substrate.

Applications: