Chip Manufacturing

Back-End Defect Inspection

ICOS CI-9x50
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Product Description

The CI-9x50 Component Inspector is a fully automated, high-speed system for the final inspection of tray-based semiconductor components. The CI-9x50 Component Inspector moves the components to the inspection stations, sorts them and, if required, transfers them to tape. The component inspector's Vision Guided Taping (VGT) technology guarantees device position verification, tape position verification and in-tape inspection.

Inspection types:
  • Gull Wing
  • J-Lead
  • BGA
  • CSP
  • Leadless devices
Applications:
  • 3D lead inspection
  • Burr/Silver inspection (option)
  • 3D Ball inspection
  • Between balls inspection (option)
  • LGA inspection (substrate inspection)
  • 2D and 3D QFN/BCC inspection
  • Socket inspection

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