The eDRTM-7110 electron-beam (e-beam) wafer defect review and defect classification system captures high resolution images of defects in order to produce an accurate representation of the defect population on a wafer. Utilizing fourth-generation e-beam immersion optics and new Real-Time Automatic Defect Classification (RT-ADC) capability, the eDR-7110 e-beam defect review and defect classification system delivers the performance required to re-locate, image and classify yield-critical defects for leading-edge design nodes. The eDR-7110 also features high throughput, enabling increased defect sampling for a more accurate defect Pareto, accelerated defect sourcing, and faster time to resolve yield issues. In addition to accurately identifying defects detected by the most advanced wafer defect inspection systems, the eDR-7110 e-beam defect review and defect classification system features several innovative applications that address a broad range of fab use cases, including critical point inspection, process window qualification, reticle defect review, and optical patterned wafer inspection recipe optimization.
- Fourth-generation e-beam immersion optics and high resolution stage produce the performance required to support defect imaging and classification of defects at the 1Xnm design node
- High precision stage produces very high coordinate accuracy, enabling the use of a 750nm field-of-view for accurately identifying and imaging the smallest defects of interest without requiring the time-consuming step of locating the defect at a lower magnification then zooming in for a clear image
- Advanced stage, low-noise deflection electronics and a vibration isolation system enable a 1.5x increase in defect review speed compared to the eDR-7000 e-beam defect review and defect classification system, permitting collection of a larger review sample in the same amount of time for a more accurate representation of the defect population on the wafer
- Real-Time Automatic Defect Classification (RT-ADC) accurately classifies defects during production and can be used during development to reduce the time required for defect discovery
- Unique Real-Time Multi-Mode Imaging capability uses RT-ADC results to automatically trigger additional in-line tests, such as compositional analysis, while the wafer is still on the eDR-7110 e-beam defect review and defect classification system, enhancing the quality of the defect information
- Fast stage speed and unique linkage to KLA-Tencor’s unpatterned wafer inspectors and broadband patterned wafer inspectors enable automated SEM review in production, thereby producing the best SEM review tool cost-of-ownership for IC fabs
- Critical Point Inspection (CPI) capability allows monitoring of known hot spots – locations where the chip design is less robust to process variation – at a very high magnification, providing R&D engineers with better information on critical patterns
- High Aspect Ratio (HAR) imaging facilitates review of defects in trenches or holes
- Field upgrade from the eDR-7100 e-beam defect review and defect classification system and extendible architecture protect a fab’s capital investment
Defect Imaging: The smallest yield-relevant defects are beyond the resolution limits of optical microscopy; therefore e-beam imaging is essential to capturing an image detailed enough for defect classification. Effective image capture on the e-beam review tool begins with reliable and efficient re-detection of the defect. The eDR-7110 e-beam defect review and defect classification system features high stage accuracy that increases the defect re-detection rate. In addition, the eDR-7110’s exceptional image quality is built upon fourth-generation immersion optics, an innovative collector configuration, and simultaneous top-down and topographic imaging. The eDR-7110 e-beam review and defect classification tool is capable of re-locating and imaging the most challenging defect types at advanced design nodes, including defects as small as 10nm or defects located at the bottom of a deep trench or hole. By resolving these challenging defect types, the eDR-7110 e-beam review and defect classification system produces defect Paretos with a much lower percentage of SEM non-visual defects and a higher percentage of defects of interest.
Defect Classification: Accurate defect classification is essential to identifying the source of the defect and addressing the issue in a timely manner. In addition to providing the sensitivity required to resolve yield-critical defects on advanced design node devices, the eDR-7110 defect classification system features high throughput, enabling increased review sampling for a more accurate representation of the defect population on the wafer. RT-ADC is used to accurately classify defects, helping speed defect sourcing. In addition, Real-Time Multi-Mode Imaging uses the results from RT-ADC to automatically trigger additional in-line tests such as imaging with alternative modes or compositional analysis using EDX, to produce complete defect information. By providing better quality images, a higher quantity of review data and accurate classification of defects, the eDR-7110 e-beam review and defect classification system delivers a more accurate defect Pareto, accelerating defect sourcing and yield.
Lithography Qualification: The eDR-7110 e-beam defect review and defect classification system can help map and monitor the process window in the lithography module, through full support of process window qualification (PWQ), focus-exposure matrix (FEM) and other standard techniques. The eDR-7110’s high throughput and support of PWQ 3.0 produce significantly faster process window qualification per layer.
Inspector Recipe Optimization: Seamless connectivity between the eDR-7110 defect review system and KLA-Tencor’s optical patterned wafer inspectors reduce recipe set up time by ~50%; produce higher quality inspection recipes and results; and enable improved productivity.
Wafer Dispositioning after Reticle Defect Detection: Innovative Reticle Defect Review (RDR) mode allows significantly simplified, accelerated review of potential reticle-induced defect sites. A statistically significant number of die can be visited, which allows more accurate wafer dispositioning.
Incoming Reticle Quality Inspection: The simplicity and speed of RDR mode facilitate the ability to check printability of reticle defects across the process window.
Bare Wafer OQC / IQC: The automated bare wafer review solution provided by the eDR-7110 e-beam review and classification system utilizes a high sensitivity optical microscope for re-detection, high resolution SEM imaging, automated defect binning, and reliable energy-dispersive x-ray (EDX) capability. Furthermore, the eDR-7110 defect review and classification system fully supports the review needs of the Surfscan SP5 – providing fast and accurate defect imaging and classification of ≤20nm bare wafer defects. This auto bare wafer review solution is used for effective sourcing of monitor wafer defect issues during development and production for wafer manufacturers – and ensures incoming wafer quality at IC fabs.