The ICOS® WI-22xx Wafer Defect Inspector performs automated optical inspection and metrology of microelectronic devices on a variety of diced and whole wafer substrates, surface inspection, and 2D bump inspection. The WI-22xx Wafer Defect Inspector offers a dramatic improvement in diced and whole wafer inspection speed, allowing manufacturers to transition to larger LED and MEMS wafer sizes. This Wafer Defect Inspector's automated optical inspection capabilities enable defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre-dice and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers. Key market segments for the diced and whole wafer defect inspection system include semiconductor IC, optoelectronics, advanced packaging, and MEMS.
The WI-22xx wafer defect inspector is a manual or automated loading system, and inspects any wafer type without hardware changeover, including whole wafers from 2 to 8 inches, diced wafers on FFC and on a hoop ring as well as surface inspection and 2D bump inspection. The WI-22xx wafer defect inspector is designed with IRIS (ICOS Review and Classification Software) which offers on and offline defect review and reclassification, as well as offline reclassification capability on any other PC. The new WI-22xx wafer defect inspector also offers advanced rule-based binning (RBB) for real-time defect classification, advanced metrology capabilities, and faster throughput for inspection as a result of new inspection and data processing technology, which allows an increase in inspection speed. This new solution works in conjunction with the Candela HBLED unpatterned wafer inspection system, to provide comprehensive, yield-improving inspection coverage to the front-end of the line, including analysis for disposition, defect reduction and excursion control.
- Surface inspection
- 2D bump inspection
- Probe mark inspection