Advanced Semiconductor Packaging
KLA-Tencor offers a series of standalone and cluster inspection and metrology systems for various applications in the advanced semiconductor packaging field. Our CIRCL-AP product supports 0.5um sensitivity all-surface inspection, metrology and review at fast throughput. It enables effective process control for advanced wafer-level packaging processes, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP) and fan-out wafer-level packaging (FOWLP). Used for advance semiconductor packaging applications associated with LEDs, MEMS, image sensors and flip-chip packaging, our WI-22x0 Series products focus on front side wafer inspection and provide feedback on wafer surface quality, quality of the wafer dicing, or quality of wafer bumps, pads and pillars. Our Component Inspector (CI) products inspect various semiconductor components that are handled in a tray, such as microprocessors, sensors or memory chips. Component defect inspector capability includes: 3D co-planarity inspection; measurement of the evenness of the contacts; component height; 2D surface inspection to check the package’s surface aspects, the identification mark and the orientation; and, the option of 5S, a bottom and all-four-side inspection that reveals certain reliability defects which are of particular interest for applications, such as mobile memory and MEMS.
Advanced Wafer-Level Semiconductor Packaging
Packaged IC Component
|KLA-Tencor Innovation: Advanced Semiconductor Packaging Portfolio|