The 2367 UV/visible brightfield inspector provides sensitivity to a broad range of yield-relevant defect types for the 65nm and above design nodes. With significantly improved throughput over its predecessor, the 2367 enables high defect sampling for cost-effective production line monitoring. It is field-upgradeable from any of the widely adopted 23xx systems, providing improved inspection capability while protecting a fab's capital investment.
- A 2x data rate increase over previous generation brightfield tools provides a major throughput improvement for more sampling, higher sensitivity, or lower cost of ownership
- Low false count rate and automatic defect classification algorithms minimize SEM review and hasten time to corrective action
- UV/DUV mix-and-match strategy with 28xx inspection systems promotes optimal tool capacity and highest overall return on a fab's inspection and investment
- Field-upgradeable from other 23xx systems extends a fab's capital investment
- Commonality and connectivity with other KLA-Tencor inspectors and review tools optimize inspector capacity; reduce production integration time; and enable faster, more accurate inspection recipe setup on the SEM
- Process Window Qualification application enables detection of systematic defects
Critical Pattern Layers (≥65nm): High resolution and noise-suppression technologies produce sensitivity to critical patterning defects, including: lithography CD variations and missing contacts; gate etch stringers; STI voids; and copper CMP corrosion.
Photo Cell Monitoring (PCM): Using the 2367 with optimized test wafers, PCM accelerates learning on lithography processes, helping fabs to rapidly identify and eliminate lithography-related micro defects before committing product wafers.
After-Develop Inspection (ADI): The 2367 minimizes process-induced noise on photo product wafers, enabling the detection of yield-limiting defects, such as poisoned photoresists, micro-bridges, and resist bubbles.
PWQ: The Process Window Qualification (PWQ) application identifies printed reticle design errors, enabling lithographers to qualify the process window for their designs prior to production.