Process Control and Yield Management Solutions

NanoPoint – Patented technology for rapid discovery and high sensitivity monitoring of defects located in yield-critical patterns on leading-edge IC devices.
SpectraShape 9000 – Optical CD and shape metrology system for production monitoring of 3D transistors, memory cells and other complex features used in high-performance IC devices.
BDR300 – Backside defect inspection and review module for the CIRCL cluster tool supporting production monitoring of yield-limiting backside defects for advanced IC design nodes.
PROLITH X4.2 – Virtual lithography tool that models how pattern will print on the wafer, enabling researchers to cost-effectively evaluate EUV, double patterning and other advanced lithography technologies.
eS805 – e-Beam inspection system leveraging exceptional resolution, sensitivity to material contrast and ability to detect buried electrical defects to enable advanced chip development and manufacturing.
ICOS WI-2280 – Enhanced defect inspection and 2D metrology for LED, semiconductor wafers, MEMS, compound semiconductor and power devices.
P-17 and P-7 Stylus Profilers – Surface profilometry systems for semiconductor, data storage, MEMS, solar, opto-electronics and general purpose markets.