featured products

• 2900 Series – Broadband optical wafer defect inspectors extend optical inspection to new limits, enabling capture of yield-critical defects on challenging process layers and die areas for advanced design rule IC devices.
• Puma 9650 – Narrowband optical wafer defect inspection system provides improved sensitivity and noise control for exceptional defect capture in yield-critical die areas on leading-edge IC devices.
• eS800 – Electron-beam wafer defect inspection system offers leading-edge physical and electrical defect capture on a wide range of layers and structures on advanced design node IC devices.
• LMS IPRO5 - Reticle pattern placement metrology system ensuring pattern placement accuracy on the mask for the 20nm node.
• eDR-7000 – Electron-beam patterned and unpatterned wafer defect review system with industry-leading sensitivity and throughput for accelerated defect sourcing at the 20nm design node and beyond.
• Surfscan SP3 – Unpatterned wafer defect and surface quality inspection system designed with deep ultra-violet sensitivity and industry-leading throughput to support IC and substrate manufacturing for the 2Xnm node.

 

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